Internship: Electro/Thermo Migration Reliability Capabilities of IC Packages

Job description

We are looking for a highly motivated student that will help us with developing new methods of testing and investigating the boundaries of the capabilities of IC packages related to thermo-migration and electro-migration. Those packages might be exposed to high temperature and/or currents for a long duration and it is essential to understand the degradation mechanisms to estimate the reliability of those packages in the field (e.g. cars, industrial applications). Your team: This opportunity is within the Corporate Quality, NTI/NPI, & Reliability (CQNR) team. CQNR’s mission is to enable corporate quality & reliability capabilities to achieve NXP's business success. CQNR accomplishes this mission through several key objectives: - Support and drive NTI/NPI success through collaboration. - Define & deploy NXP's quality & reliability policies with a wide range of processes, methods, data, and tools. - Develop reliability competence for NXP with our strategic partners. What’s in it for you: - A great opportunity to develop your skills (technical, soft skills, communication, etc.). - Gaining experience in a multinational and diverse environment. - Working on real assignments which contrib...