Microelectronic System and Packaging Mold Flow Simulation Engineer
onsemi · Munich, Bavaria, DE
onsemi is seeking a self-driven and motivated professional to join their Corporate R & D modeling and simulation team, located in Germany.
Job description
onsemi is seeking a self-driven and motivated professional to join their Corporate R & D modeling and simulation team, located in Germany. As a microelectronic system and packaging mold flow simulation engineer, you will have the opportunities to support new power module and system development and new product design, assembly and process, quality and reliability, and customers in worldwide. Performance Objectives: The successful candidate will have the opportunity to: onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. - Mold flow simulation for thermal setting and thermoplastic in both transfer and injection molding. - Do thermal-mech simulation for microelectronic packaging and system, assem...