Advanced Packaging Development Engineer, Quantum AI

Job description

Minimum qualifications: - Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience. - 3 years of experience developing advanced packaging solutions. - 3 years of experience delivering Research and Development (R&D) concepts to a released product. - 3 years of experience with one or more of the following technologies: 2.5D/3D integration, wafer-level packaging, panel-level packaging, or hybrid bonding. Preferred qualifications: - Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field (e.g., Optics, Sensors, Audio/DSP). - Experience using simulation tools to evaluate electrical/RF, thermal, or mechanical performance of packaging structures and guide new designs. - Experience in a semiconductor packaging environment. - Familiarity with quantum computing hardware architectures and the specific constraints they impose on packaging design. About the job: As an Advanced Packaging Engineer, you will be a key contributor to the research and development of next-generation packaging platforms for superconducting q...