Package & SI/PI - Signal and Power Integrity Engineer

Job description

Join the leading chiplet startup from the ground floor! As a Signal and Power Integrity Engineer, you will provide packaging solutions for chiplet interconnects in a fast-paced early-stage startup creating technologies that fuel tomorrow’s chiplet-based systems with best-in-class power, area, manufacturability, and design flexibility. You will be responsible for design, modeling, manufacturing, assembly, and testing of traditional and advanced packaging for Eliyan’s chiplet solutions. You will work with a cross-functional team of industry experts that operate from first principles, innovate and push the envelope to create high-volume and high-performance manufacturable products. We offer a fun work environment with excellent benefits. Key Responsibilities: - Working closely with analog circuit designers to understand and define IO requirements co-designed with the channel - Responsible for pre-layout and post layout channel simulation and optimization to achieve the best performance - Using driver/receiver models to run transient channel simulation, inspect eye diagrams, and improve the performance - Applying best practices for the design of power delivery networks, extracting mode...