Principal HIG ESD and Latch-up Engineer- HBM - TPG
Micron Technology · Folsom, California, US
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solut...
Job description
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s HBM Design Architecture organization, where we push the limits of memory technology every day. Our team works across global, multicultural engineering groups to build next-generation HBM solutions that power AI and machine learning. We believe the best ideas come from collaboration, curiosity, and a shared drive to innovate! This role plays a critical part in ensuring the reliability of Micron’s most advanced DRAM and HBM products. As an ESD & Latch Up Engineer, you will shape protection strategies from early design through high-volume manufacturing, working hands-on with silicon, layout, and foundry partners. If you enjoy solving deep technical problems and influencing product robustness at scale, this role offers both impact and growth. Responsibilities: - Define and own chip-level and IP-level ESD and latch up strategies for HBM DRAM, base die, I/O, TSVs, an...