Wafer Packaging Manufacturing US/EUR Sort Leader

Job description

Job Details: Job Description: About the Team Wafer Packaging Manufacturing (WPM) is a worldwide factory network specializing in the processing and testing of product as we make interconnects and transform wafers into die. WPM organization is part of APTM (Advanced Packaging Technology and Manufacturing) within Intel Foundry. The organization includes the process segments and factories for: FBE/C4 (RDLs/Passivation/Bumping), Wafer Level Assembly (WLA), Hybrid Bond Interconnect (HBI), Die Prep, Die Sort, E-Test, and Wafer Sort. The team processes both traditional and advanced packaging products and are responsible for high volume manufacturing with high quality of Intel Products and Foundry Services products. WPM works with upstream factories (TFSM and External companies) and downstream factories (ATM and External OSATs) within the overall supply chain as well as many other Intel organizations. We strive to be the best in the world in our process segment while providing fulfilling careers for our team members in an inclusive and learning environment. About the Role: The WPM US/Europe Wafer Sort and Die Sort Factory Manager will lead the Sort factories in the US and Europe regions. Th...