Back Grind/Back Metal Post Fab Engineer

Job description

onsemi is seeking a highly motivated engineer to work in our Technology Development group as a Process Integrator focused on wafer thinning and backmetal development on new CMOS, BCD, Image Sensor, and other new/novel technologies. This will include driving continuous improvement on new processes, new product architecture and technologies, Yield and Performance improvements, and New Product/Technology Introduction and ramp to volume manufacturing. Essential Responsibilities: - Support new semiconductor technology from early development phase through volume manufacturing phase, including full documentation to support ONSEMI’s process change review process. - Work with a global matrixed team while driving projects and results independently. - Effectively communicating with all levels of the organization, including the executive staff. - Operating independently, while taking high-level objectives into account. - A team player with strong listening skills who can take input and make informed decisions. - Using probe, in-line test, and failure analysis data to develop and drive process improvements. - Drive cost reduction through yield enhancement and process simplification. Required Qu...