Principal Engineer, Advanced Packaging

Job description

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of cutting‑edge memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration! As a Principal Engineer on our APTD team in Boise, you’ll play a key role in shaping next‑generation semiconductor packaging technologies. This is a highly influential position where your technical insight and leadership directly impact product quality, reliability, yield, and cost. You’ll work across disciplines, mentor teams, drive innovation, and help guide the packaging technology roadmap. Responsibilities: Identify, diagnose, and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology Coordinate...