MTS 3D Heterogenous Integration Engineer

Job description

About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com. Summary of Role: GlobalFoundries Fab8 is seeking an experienced and dedicated R&D engineer, joining Advanced Packaging Lab (APL) to lead advanced 3D Heterogeneous Integration (3D-HI) initiatives, such as wafer-to-wafer hybrid bonding, die-to-wafer hybrid bonding, TSV/TOV, and interposer development. Essential Responsibilities: - Drive 3D-HI process development efforts for the building blocks required for advanced packaging solutions needed by the GlobalFoundries product lines (e.g. , multi-die stacking, die-to-wafer / wafer-to-wafer fine pitch hybrid bonding, etc.). - Partner with unit process engineers, manufacturing engineers, as well as directly with the tool and material vendors for the GlobalFoundries fabs. - Collab...