SMTS - 3D Heterogenous integration Engineer - 2.5D interposer/bridge/DTC

Job description

About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com. Summary of Role: GlobalFoundries Advanced Packaging Lab is seeking an accomplished engineer with extensive expertise in chiplet-based system integration, specifically within 2.5D interposer/bridge and 3D heterogeneous integration technologies. This senior technical position entails end-to-end integration responsibility for advanced heterogeneous solutions, encompassing silicon, glass, and mold interposers as well as embedded silicon bridge architectures. Essential Responsibilities: - Lead 2.5D/3D advanced packaging technology platforms (e.g. silicone/glass/mold interposer, silicon bridge, deep trench capacitor, etc.) integration strategy and readiness, including interface requirements and co-optimization with fabrication...