Package Design Engineer

Job description

Company Description Renesas is a global leader in microcontrollers, analog, power, and SoC products, delivering semiconductor solutions that power billions of connected, intelligent devices. As the industry shifts toward heterogeneous integration, we are leading the charge in advanced packaging and are seeking a talented Package Design Engineer to join our Advanced Silicon Packaging team to design and deliver the next-generation, high-performance packaging solutions that power our world-class product portfolio. Job Description: In this role, you will be at the intersection of silicon design and system implementation. You will play a critical part in designing and delivering next-generation, high-performance packaging solutions; including 2.5D/3D, chiplet-based, FCBGA, SiP, WLCSP, wire bond, and QFP/QFN packages that power our industry-leading automotive SoCs, industrial IoT microcontrollers, and AI-forward computing platforms. This role demands strong technical depth in package layout execution, a deep understanding of manufacturability, and a collaborative mindset for cross-domain co-design with our global silicon, SI/PI, thermal, and reliability teams. Key Responsibilities: - Exe...