Principal Engineer- Advanced Packaging TD

Job description

About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact: Packaging TD: What You Can Expect: - Technology Development & Integration - Develop and mature advanced packaging technologies from concept to production-ready solutions. - Drive integration of new technologies into product platforms, ensuring alignment with system requirements and manufacturing constraints. - Architecture Implementation & Co-Design - Define and implement package architectures including chiplet topology, interconnect strategy, interposer/substrate design, and power delivery networks. - Lead co-design across silicon, package, and system to optimize performance, power, and area. - Design Rules, Me...