IC Package Engineer

Job description

About Etched Etched is building AI chips that are hard-coded for individual model architectures. Our first product (Sohu) only supports transformers, but has an order of magnitude more throughput and lower latency than a B200. With Etched ASICs, you can build products that would be impossible with GPUs, like real-time video generation models and extremely deep chain-of-thought reasoning. IC Package Engineer We are seeking an experienced IC Package Design Engineer to drive and own all aspects of substrate layout and package design work. The ideal candidate will have extensive experience with advanced packaging technologies such as CoWoS, large-scale BGA designs, and package warpage mitigation strategies. You will play a key role in ensuring the mechanical and electrical integrity of packages that power the next generation of AI hardware. Representative Projects: You maybe a good fit if you have We encourage you to apply even if you do not believe you meet every single qualification. - Own the end-to-end package design process, including substrate layout and IC package design, while collaborating with internal teams and external vendors to deliver optimized, manufacturable solutions...