Director of Advanced IC Packaging Development

Job description

Job Description Renesas is seeking a Director of Advanced IC Packaging Development to lead the Next Generation Power Packaging roadmap. This role is pivotal in enabling the AI and Datacenter revolution by developing cutting-edge Smart Power Stages, Vertical Power Stages, Power Modules and Wide Bandgap (SiC/GaN) solutions. You will oversee the entire lifecycle from R&D and NPI to high-volume global OSAT management, ensuring Renesas remains at the forefront of power density and thermal efficiency. Responsibilities: 1. Technology Roadmap & R&D Strategy 2. Global OSAT & Supply Chain Management 3. NPI, Qualification & Quality Control 4. Cross-Functional Leadership - Define and execute the global packaging roadmap, focusing on Power SiP/Modules , Wafer Level Packaging , and Flip-Chip technologies. - Lead R&D initiatives for Wide Bandgap (SiC & GaN) power devices, utilizing advanced substrates like DBC (Direct Bonded Copper) and AMB (Active Metal Brazing) . - Manage the annual R&D budget and oversee customer adoption programs to align technical capabilities with market demand. - Establish and maintain corporate package design rules to ensure manufacturability and reliability - Benchmark,...