R&D Engineer

Job description

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: The ideal candidate will have expertise in advanced packaging technology, and ‘system in package’ assembly, including manufacturability and reliability issues with wide-ranging experience in semiconductor device fabrication and operation, test development and execution, reliability failure mechanisms and testing, assembly process development and qualification, and wafer foundry manufacturing operations. Can translate system-level performance requirements into modules and collaborate directly with external foundry R&D teams, OSATs to identify and/or jointly-develop candidate technologies. Typically possesses a graduate degree in electrical engineering and has several years of experience in the field. Responsibilities include: Technical lead for multi chip semiconductor assembly and system pathfinding for leading-edge artificial intelligence and high-performance computing modules. Owns key portions of the advanced packaging and assembly, and sy...