Substrate IC Package Design Engineer - Remote

Job description

About Syenta Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Metallization (LEM) technology. Our platform enables advanced packaging by combining patterning and metallisation into a single tool. We achieve high-speed, high-resolution metallisation at significantly lower cost and energy use, while minimizing emissions and waste. Founded in Australia, we are building a world-class team tackling some of the toughest challenges in semiconductor manufacturing. Our collaborative, people-first culture empowers individuals to take ownership, move quickly, and deliver meaningful impact. About the Role: This role is a critical addition to Syenta’s technical capabilities, enabling in-house design of advanced substrate IC packages and multi-layered interposers. You will play a foundational role in developing designs that underpin next-generation packaging architectures, including high-performance chip-to-chip integration approaches. Working at the intersection of electrical, thermal, and mechanical design, you will lead the development of complex substrate layouts that directly enable fabrication and deployment of our platform. Th...