Packaging Module Development Engineer

Job description

Job Details: Job Description: Join Intel's Packaging Module Development team and play a pivotal role in shaping the future of assembly packaging technologies. As a Packaging Module Development Engineer, you will develop innovative material and design solutions that drive Intel's roadmap for next-generation assembly and packaging solutions. Your contributions will directly impact the efficiency, reliability, and quality of Intel's manufacturing operations, enabling cutting-edge technologies to thrive in competitive markets. This is an excellent opportunity to work on complex challenges, collaborate with cross-functional teams, and lead advancements that redefine industry standards. Qualifications: Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. - Develop and qualify thermal material solutions such as Integrated Heat Spreaders (IHS) aligned with Intel's packaging tec...