Strategic Technology Lead – Advanced 3DIC Packaging & Integration (Mobile/STCO)

Job description

Huawei Heisenberg Research Center (Munich) is responsible for advanced technology research, architectural development, design and strategic engineering of our products. We are chip platform team in Munich research center. We keep growing together with our continuous business success and strong partnership, and welcome all excellent experts and talents to join us. Join us as a: Strategic Technology Lead – Advanced 3DIC Packaging & Integration (Mobile/STCO) (m/f/d) Your mission: As a key role driving internal and external strategic R&D programs in the field of mobile 3DIC STCO/XTCO, you will: Evaluate emerging technologies and their commercial potential through in-depth research, including literature reviews, technology trend analysis, and simulations. Produce high-impact technology analysis reports for senior leadership (chief scientists, executives, and decision-makers) to guide strategic direction. Conduct early-stage feasibility studies and simulations to shape technical roadmaps. Define and drive corporate & business unit (BU) innovation programs, ensuring alignment with long-term objectives. Manage the international network and engage with external partners, including researche...