Principal Product Engineer (Adv Pkg Pathfinding), Heterogeneous Integration Group(HIG), High Bandwidth Memory (HBM)

Job description

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the member of HIG HBM Package Product Engineering, you will lead and develop a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a distributed team of professional Product Engineers managing a portfolio of outstanding Next Generation HBM products. The team is passionate about Quality, Cost, Cycle Time, and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually enhancing the efficiency of the HIG HBM PE organization. Responsibilities: - Collaborate with Advanced Package Technology team to enable sophisticated interconnect technology solutions that include wafer to wafer bonding. This includes working with Test Solutions team to enable the tests solutions, providing analysis of yield and electrical chara...