Thermal Engineering Intern

Job description

Description Futurewei has opening for Thermal Engineer intern. Candidates will participate in cutting edge research in next-generation electronic devices and packages. This role focuses on heat transfer challenges in high-power and high-density electronics. The intern will have the opportunity to work alongside and learn from senior researchers to explore and develop new and impactful technologies. Responsibilities: - Perform electronic package and system level thermal analysis. - Design, develop, test innovative system-level cooling solutions. - Analyze heat dissipation, temperature distribution, and thermal resistance in device structures, including interfaces and thin films. - Assist in modeling thermal boundary conductance (TBC) and interfacial heat transport in heterogeneous material systems. - Provide research input on early explorations: determine the scope of the problem, the best use of ML, and the merits of different approaches. - Integrating latest research into applied projects. - Prepare reports, manuscripts, proposals, and technical manuals for use by other scientists. Qualifications: - Master’s degree, Ph.D. or Ph.D. candidate in Mechanical Engineering, Materials Sci...