Test Module Development Engineer

Job description

Job Details: Job Description: Intel's Advanced Packaging Technology Manufacturing (APTM) group is a critical division driving the next generation of semiconductor packaging solutions. The team focuses on groundbreaking technologies that extend beyond traditional methods to enable the future of high-performance computing. Primary Focus: - Advanced semiconductor packaging technologies beyond conventional approaches - 3D packaging innovations and chiplet integration - High‑performance computing packaging for data centers and AI applications - Heterogeneous integration across diverse chip technologies - Scaling packaging density while enhancing thermal and electrical performance Key Objectives: Test Module Development Engineer responsibilities include but are not limited to: - Advance Moore's Law through cutting‑edge packaging technologies - Reduce system‑level power consumption while improving overall performance - Support Intel's IDM 2.0 strategy and Intel Foundry Services - Develop packaging solutions tailored to emerging workloads such as AI and edge computing - Executes test technology development and enablement for high‑mix, low‑volume testing and future technologies, provides pr...