Principal Physical Design Engineer, HBM

Job description

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities: - Lead end‑to‑end physical design for High Bandwidth Memory (HBM) base and memory dies from netlist through GDSII, including floorplanning, power planning, placement, clock tree synthesis, routing, and signoff. - Define and drive HBM‑specific physical architecture, including channel partitioning, physical layer (PHY) placement, through‑silicon via (TSV) keep‑out regions, and die‑package co‑design alignment. - Optimize bandwidth, latency, power, and yield through architecture‑level tradeoffs and collaboration with memory architecture, PHY, RTL, synthesis, design‑for‑test, and packaging teams. - Lead power delivery network design and ensure IR drop, electromigration, and thermal closure across all operating modes. - Oversee timing closure across corners for high‑speed logic and HBM PHY interfaces, addressing signal integrity, noise, and crosstalk. - Ensure physical sig...