IC Package Design & Automation Engineer

Job description

The successful candidate will design and validate high‑speed packages through EM simulation, signal/power integrity analysis, and correlation with lab test & measurement verification. In addition, you will develop and maintain ADKs across multiple EDA platforms, including rule decks, parameterized cells, technology files, and automated verification flows. - Design, Modeling, and Verification - Perform high‑speed package design for advanced heterogenous packages (e.g., SiP, FC‑BGA, 2.5D/3D, chiplets) for high-speed RF and Optoelectronics. - Build and refine 3D EM models of package structures (transmission lines, interconnect and EM passives, etc.). - Run and interpret EM, SI, and PI simulations (S‑parameters, TDR/TDT, eye diagrams, crosstalk, impedance, PDN impedance). - Define and validate routing topologies and stackups to meet timing, loss, crosstalk, and impedance requirements. - Collaborate with silicon, board, and system teams to co‑optimize package, die, and PCB for end‑to‑end performance. - Correlate simulation results with lab measurements (VNA, TDR, high‑speed scopes) for model validation and sign‑off. - ADK, EDA Flows, and Automation - Develop and maintain Assembly Design...