Sr. Principal Engineer – GaN Package Development (m/f/d)
Nexperia · Munich, Bavaria, DE
As Senior Principal Engineer – GaN Package Development (m/f/d), you will be a technical authority and innovation leader responsible for defining, developing,...
Job description
About the role As Senior Principal Engineer – GaN Package Development (m/f/d), you will be a technical authority and innovation leader responsible for defining, developing, and industrializing advanced packaging technologies for GaN power devices and modules. This role drives package architecture strategy, leads complex cross‑functional programs from concept to high‑volume manufacturing, and serves as a key technical interface across R&D, manufacturing, suppliers, and customers. The position requires deep expertise in GaN backend technologies, strong system‑level understanding of power device requirements, and proven leadership in introducing new packaging platforms into production. This is your new job: Lead GaN package architecture development, from concept through validation, optimizing electrical, thermal, and reliability performance Drive innovation in packaging technologies, materials, and process solutions tailored to GaN devices Develop and industrialize backend assembly processes from R&D to high-volume manufacturing Ensure manufacturability, cost efficiency, and successful technology transfer to internal sites and/or OSAT partners Act as technical lead across cross-functi...