PCB Manufacturing Engineer, Quantum AI

Job description

Minimum qualifications: - Bachelor’s degree in Mechanical, Electrical, or Manufacturing Engineering or equivalent practical experience. - 2 years of experience working with electronics packaging, including wire bonding, die preparation, or printed circuit boards (PCBs). - 2 years of experience designing, manufacturing, or testing PCBs. - 2 years of experience managing production processes (vendor management, continuous process improvements, tool ownership, or monitoring and control of existing processes). - Experience using statistical process control (SPC) and design of experiments (DOE) to develop or improve manufacturing processes. Preferred qualifications: - Master's degree in Mechanical, Electrical, or Manufacturing Engineering or a related field. - 2 years of experience in a semiconductor packaging environment. - Experience with Electrostatic Discharge (ESD) sensitive devices. - Experience with automated inspection and test. - Experience in wirebonding processes (e.g., ball, wedge). - Knowledge of Six Sigma or other lean manufacturing methodologies. About the job: In the Device Packaging Group, we build custom packaging technologies for quantum processors, amplifiers, and oth...