Packaging Module Development ENgineer

Job description

Job Details: Job Description: Join Intel's Advanced Packaging Technology Development organization as a Packaging Module Development Engineer. In this critical role, you will drive the development and optimization of processes and equipment that enable Intel's future assembly packaging platform technologies. Your contributions will directly impact the manufacturability and reliability of next-generation products, ensuring Intel remains a leader in advanced IC packaging solutions. You will collaborate with cross-functional teams to develop innovative methods, solve complex engineering challenges, and design processes to meet quality, cost, yield, and productivity targets. This is an opportunity to shape the future of packaging technology while working within a dynamic and supportive environment that values creativity and collaboration. Qualifications: Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and...