Optoelectronic IC Package Design Director

Job description

As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We’re a technology company that leads with our humanity—driving our business priorities alongside meaningful social, community, and societal impact. As Optoelectronic IC Package Design Director, you will be an integral part of the xPO engineering team and lead package development for custom in-house photonic, analog, and digital ICs, supporting next generation optical modules. How You Will Make an Impact: - Own and drive advanced package selection, new product BGA configuration, and package structure - Own and manage package development schedules - Responsible for package layout, SI/PI optimization, design verification and tapeout - Interface and coordinate with cross-functional groups on new product package selection, feasibility analysis and design - Work cross-functionally, understand trade-offs, constraints, and optimize silicon floor plan, bump and package pin out - Simulate and optimize signal and power integrity and RF performance of the package...