JobMesh

Module Development Engineer- Hybrid Bonding

Intel · Hillsboro, Oregon, US

Job Description: Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere.

Job description

Job Details: Job Description: Embark with us on a journey of growth and transformation as we create exceptionally engineered technology and bring AI everywhere. As a valued team member, your adaptability and attention to detail will contribute to our drive for results and relentless pursuit of quality, ensuring we meet our customers' needs with precision. Join us and build on our legacy of innovation and collaboration as we deliver world-changing technology that improves the life of every person on the planet. In Oregon Advanced Packaging (ORAP) Intel, we are at the forefront of innovation, creating world-changing technology that enriches the lives of every person on the planet. Oregon Advanced Packaging (ORAP) is looking for a highly energetic and innovative Module Development Engineer, who has a strong technical background to drive for the best equipment performance and product quality in a safe and cost-effective manner. This role requires regular onsite presence to fulfill essential job responsibilities. Job Scope includes but are not limited to: - Owning execution of maintenance and repair activities for equipment and relevant module of components. Initiates and owns the conti...