Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly Quality Engineer

Job description

Job Details: Job Description: APTD Substrate is at the center of making Intel Foundry's and APTM's advanced package substrate roadmap a reality. We do this by collaborating with external suppliers to demonstrate disruptive packaging architectures and integrate them into certifiable products. These products will be volume manufactured within our substrate factory network. The Quality Engineer's (QE) quest to elevate quality standards at substrate suppliers is vital for the organization to meet customer expectations in an ultra-competitive IFS environment. We are looking for a supplierfacing Quality Engineer who is a strong communicator and executiondriven leader, capable of proactively assessing quality system gaps, establishing improvement roadmaps, and partnering with suppliers to execute disciplined plans that elevate longterm quality capability and effectiveness. This role will help realign all factories to our quality expectations. The ideal candidate possesses working knowledge of phase gate quality requirements that support successful validations as well as exposure to substrate manufacturing process flow. In direct partnership with our Program Integration and Yield teams, th...