Packaging Module Development Engineer

Job description

Job Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing. As a Packaging Module Development Engineer, you will. - Contribute to the advancement of technology and foundry capabilities by developing First Level Interconnect (FLI) to support Intel's future packaging platforms. - Collaborate with multifunctional, cross organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability. - Drive innovation in next generation equipment, materials, and fabrication processes to scale advanced semiconductor packaging capabilities - Lead equipment development activities, including pathfinding, new equipment definition, selection, technology development, and transition to high volume manufacturing. - Manage projects to ensure alignment with product development schedules and...