Packaging Module Development Engineer

Job description

Job Details: Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing. The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by: Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates. - Provide mechanical modeling support for a variety of R&D projects ranging from Pathfinding, Technology Development, and High-Volume Manufacturing (HVM) issue resolution. - Work with Equipment and Process Engineers to define problem statement and boundary conditions. Apply expertise to conduct theoretical analysis and/or numerical modeling to find solution path. Seek opportunities to improve equipment design and process de...