Substrate Packaging Defect Metro tool owner

Job description

Job Details: Job Description: We are seeking a motivated and skilled engineer to join our Advanced Packaging Technology and Manufacturing (APTM) Yield & Product Development team as a Substrate Packaging Defect Metro tool owner . In this role, you will play a critical part in enabling next‑generation advanced packaging technologies, including EMIB‑T, glass core, EMIB scaling, and panel‑level packaging, supporting both substrate and assembly test manufacturing (ATM) factories. Our goal is to be the supplier of choice for advanced, cost-effective substrate packaging by developing leading-edge systems, process capabilities, and inspection technologies to achieve top yields. Join us on our mission to make Intel a great workplace and industry leader. Key Responsibilities will include but are not limited to: - Use defect inspection tools to detect and resolve process issues, collaborating with defect reduction, process integration, and module teams to improve yield. Apply real-time data analysis, reporting, and DOE summaries to guide improvements and decision-making. - As a Micro-contamination and Defect metrology expert, apply advanced contamination detection and control strategies to ma...