Head of Physics AI - Thermal-Mechanical Reliability

Job description

Flexcompute is the physics company. We bridge first-principles physics and neural foundation models to redefine the boundaries of industrial simulation and design. We believe that the next era of engineering will be defined by the convergence of massive parallel computing and artificial intelligence. Our core technology features the world’s fastest GPU solvers, capable of delivering orders-of-magnitude speedups over traditional tools. By integrating these solvers with our Physics AI Foundation Models, we enable engineers to explore design spaces that were previously computationally inaccessible. At Flexcompute, we don’t just make simulations faster; we make the “impossible” solvable, helping our partners tackle the most critical challenges in 3D-IC design, aerospace, and beyond. Flexcompute is seeking a visionary technical leader to head our new division focused on 3D-IC Thermal-Mechanical Reliability. In this role, you will be the primary architect of how we apply our world’s fastest GPU solvers and Physics AI Foundation Models to the semiconductor industry’s most critical bottleneck: the structural and thermal integrity of advanced packaging. You will lead the strategy for solvin...