R&D Engineer: Test Engineering Wafer Test, Final Module Test & Characterization

Job description

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: Development of device testing at wafer level, die level and module level More specific duties include the following: - Definition of test requirements and test methods for our optoelectronic transceiver and sensor products as well as for our in-house mixed signal ASICs and sensor chips, which are used within these products. - Development, bring up and debugging test hardware and software for evaluation, device characterization (bench) and production testing. This can be either completely in-house or in cooperation with external engineering partners. - Design of test application PCBs, test sockets, probe cards. - Handover of test solutions to the production site or to external test houses. - Full characterization of the devices over corner conditions, according to specification. - Evaluation, analysis and reporting of characterization results and production test results along with creation of respective reports. - Close cooperation with IC-des...